Equipment Applications
Different Applications of Wafer AOI Products
01
Processor Chip
Characteristics:
1.Complex graphical background.
2.Requirement for 3D measurement of bumps.
3.High defect rejection criteria.
02
Communication Chip
Characteristics:
1. High detection accuracy in optical port areas.
2. Requirement for measurement of optical port width.
03
Memory
Characteristics:
1.High number of pads.
2.High pattern repetitiveness.
3. General defect rejection criteria.
04
Sensor Chip
Characteristics:
1.High detection accuracy on light-receiving surfaces.
2.Small die size.
3.General defect rejection criteria.
05
Power Management
Characteristics:
1.Noisy background.
2.Many needle marks.
3.General defect rejection criteria
Applications of Wire Bonding AOI Products in Different Packaging Types
Gold Wire Inspection
3D Gold Wire Inspection
TO Series
Photosensitive Chip
LED Chip
Applications of Leader Scan Products in Different Packaging Types
QFP-Lead Collapse (2D)
QFP-Lead 3D Measuremen
QFN-Foreign Material
Pre-Seal Inspection - Reel Product
Reversed
BGA- Solder Ball (Pad) Foreign Material
Contamination
Jiaxing Jiuzong Intelligent Technology Co., Ltd.
Jiaxing Headquarters
Address: Building 6, Visual Internet of Things Innovation Centre, Tongxiang Economic Development Zone
Ningbo Branch
Address: No.2588, Sanbei Street, Baisha Road Street, Cixi City, Zhejiang Province
Shenzhen Branch
Address: No.27-3, Xintang Road, Fuhai Street, Baoan District, Shenzhen City
Changsha Branch
Address: Wuju Lane, Langli Street, Changsha County, Changsha City
Wuhan Branch
Address: Building 5, Future Light, Optics Valley Avenue, East Lake New Technology Development Zone, Wuhan City
Scan code consultation more
© Jiaxing Jiuzong Intelligent Technology Co., Ltd.