Chip packaging

Chip packaging refers to the process of enclosing semiconductor chips in protective casings to ensure their functionality and reliability. This packaging serves multiple purposes, including protecting the chip from physical damage, environmental factors, and electrical interference, while also providing a means for connecting the chip to other electronic components. Various types of chip packaging exist, such as dual in-line packages (DIP), surface-mount devices (SMD), and ball grid arrays (BGA), each suited for different applications and performance requirements.

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