1. Monitor Installation: Size Optional.
2. Die bonder vision module addition, after confirming the die bonding action through sensors, a photo is taken for image acquisition.
3. Automatic inspection process, imaging and image acquisition for inspection after die bonding.
4. Inspection capabilities: chip presence, chip edge, chip angle, solder melt anomaly.


Equipment Scheme 1
Equipment Scheme 2
Software Introduction
‹ Left side of the software: real-time display of inspection results.
‹ Right side of the software: for debugging and production operations.
1. Adjustment of defect parameters is possible.
2. Optional real-time path for camera image acquisition and inspection.
3. Production data statistics.
Inspection Effect
- Product Description
-
- Commodity name: DB Eqiupment Retrofit
- Commodity ID: D-003
Equipment Scheme 1
Equipment Scheme 2
Software Introduction
‹ Left side of the software: real-time display of inspection results.
‹ Right side of the software: for debugging and production operations.1. Adjustment of defect parameters is possible.
2. Optional real-time path for camera image acquisition and inspection.
3. Production data statistics.
Inspection Effect
Keywords :
AOI Equipment
Automation
Software Systems
AOI Vision Upgrade
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