Classification:
Hawkeye-WAP8055
Wafer 2D&3D Inspection System
Application: Applied to front-end processes of integrated circuits and advanced packaging, it enables comprehensive defect inspection in 2D and 3D circuit patterns.
• Self-developed PL Fluorescence Light Source
• 3D Bump Metrology
• Wafer Stacking Inspection
Capability
|
Project |
Content |
|
Product Type |
6’, 8’, 12’ frame wafer, 2.5D/3D package |
| 2D Inspection Items |
Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive needle marks, etc |
|
2D Measurement |
Bump diameter, needle mark coordinates, RDL and TSV metrology, etc |
|
3D Inspection Items |
Bump height , Bump co planar ity |
|
Cassette & Transmission Mode |
8" SMIF/Cassette， 12" FOUP |
| Lens & Resolution |
2x（ 2.75um）/3.5x（ 1.57um） / 5x（ 1.1um）/7.5x（ 0.73um） / 10x（ 0.55um）/20x（ 0.275um） |
|
Accuracy |
0.275μm/pixel |
|
Optional and Customized |
Double sided OCR , 3D module , supported by E84 |
Imaging
 CD/CT Metrology |
 CD/CT Metrology |
 Single-pin Mark Inspection |
 Multi-pin Mark Inspection |
 BUMP Height |
 BUMP Coplanarity Heat Map |
 NG Map |
 Defect Heat Map |
- Product Description
-
- Commodity name: Wafer 2D&3D Inspection System
- Commodity ID: A-001
- 型号: Hawkeye-WAP8055
- 应用: <strong>Application:</strong> Applied to front-end processes of integrated circuits and advanced packaging, it enables comprehensive defect inspection in 2D and 3D circuit patterns.
• Self-developed PL Fluorescence Light Source<br> • 3D Bump Metrology<br> • Wafer Stacking Inspection
Capability
Project
Content
Product Type
6’, 8’, 12’ frame wafer, 2.5D/3D package 2D Inspection Items Foreign objects, residual glue, particles, scratches, cracks, contamination, CP
deviation, excessive needle marks, etc
2D Measurement
Bump diameter, needle mark coordinates, RDL and TSV metrology, etc 3D Inspection Items
Bump height , Bump co planar ity Cassette & Transmission Mode
8" SMIF/Cassette， 12" FOUP Lens & Resolution 2x（ 2.75um）/3.5x（ 1.57um） /
5x（ 1.1um）/7.5x（ 0.73um） /
10x（ 0.55um）/20x（ 0.275um）
Accuracy
0.275μm/pixel Optional and Customized
Double sided OCR , 3D module , supported by E84 Imaging
CD/CT Metrology
CD/CT Metrology
Single-pin Mark Inspection
Multi-pin Mark Inspection
BUMP Height
BUMP Coplanarity Heat Map
NG Map
Defect Heat Map
Keywords :
AOI Equipment
Automation
Software Systems
AOI Vision Upgrade
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