Wafer 2D Defect Inspection System
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  • Wafer 2D Defect Inspection System

Classification:

Hawkeye-WST6055

Wafer 2D Defect Inspection System


Application: Applied to shipment after wafer cutting/postseal cutting, it inspects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency.

• Compatible Frame Wafer
• IR Hidden Crack Support
• INK inkjet Support

Capability

Project

Content

Product Type

6 ", 8 ", 12 " frame wafer

2D Inspection ltems

Foreign objects, residual glue, particles, scratches, hidden cracks, contamination, CP

deviation, excessive area, etc

Cutting channel deviation and chipping

Cutting Path

Inspection Items

6 ", 8 ", 12 " frame cassetee

Lens and

Resolution

2x( 2.75um)/3. 5x( 1. 57um)/

5x( 1. 1um)/7. 5x( 0.73um)/ 10x( 0. 55um)

Precision

0. 55μm/pixel

Optional and Customized

INK module,  IR module

Inspectable Area

Front side inspection(standard configuration), back side inspection(customizable)

 

Imaging



Scratch


Dirt


IR with Crack


IR without Crack


Probe (Pad corrosion)


Probe (skewing)


Cutting edge  chipping


Ink dot inspection

 

  • Product Description
    • Commodity name: Wafer 2D Defect Inspection System
    • Commodity ID: A-002
    • 型号: Hawkeye-WST6055
    • 应用: <strong>Application:</strong> Applied to shipment after wafer cutting/postseal cutting, it inspects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency.

    • Compatible Frame Wafer<br> • IR Hidden Crack Support<br> • INK inkjet Support

    Capability

    Project

    Content

    Product Type

    6 ", 8 ", 12 " frame wafer

    2D Inspection ltems

    Foreign objects, residual glue, particles, scratches, hidden cracks, contamination, CP

    deviation, excessive area, etc

    Cutting channel deviation and chipping

    Cutting Path

    Inspection Items

    6 ", 8 ", 12 " frame cassetee

    Lens and

    Resolution

    2x( 2.75um)/3. 5x( 1. 57um)/

    5x( 1. 1um)/7. 5x( 0.73um)/ 10x( 0. 55um)

    Precision

    0. 55μm/pixel

    Optional and Customized

    INK module,  IR module

    Inspectable Area

    Front side inspection(standard configuration), back side inspection(customizable)

     

    Imaging



    Scratch


    Dirt


    IR with Crack


    IR without Crack


    Probe (Pad corrosion)


    Probe (skewing)


    Cutting edge  chipping


    Ink dot inspection

     

Keywords :

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