
Classification:
Hawkeye-WST6055
Wafer 2D Defect Inspection System
Application: Applied to shipment after wafer cutting/postseal cutting, it inspects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency.
• Compatible Frame Wafer
• IR Hidden Crack Support
• INK inkjet Support
Capability
Project |
Content |
Product Type |
6 ", 8 ", 12 " frame wafer |
2D Inspection ltems |
Foreign objects, residual glue, particles, scratches, hidden cracks, contamination, CP deviation, excessive area, etc Cutting channel deviation and chipping |
Cutting Path Inspection Items |
6 ", 8 ", 12 " frame cassetee |
Lens and Resolution |
2x( 2.75um)/3. 5x( 1. 57um)/ 5x( 1. 1um)/7. 5x( 0.73um)/ 10x( 0. 55um) |
Precision |
0. 55μm/pixel |
Optional and Customized |
INK module, IR module |
Inspectable Area |
Front side inspection(standard configuration), back side inspection(customizable) |
Imaging
![]() Scratch |
![]() Dirt |
![]() IR with Crack |
![]() IR without Crack |
![]() Probe (Pad corrosion) |
![]() Probe (skewing) |
![]() Cutting edge chipping |
![]() Ink dot inspection |
- Product Description
-
- Commodity name: Wafer 2D Defect Inspection System
- Commodity ID: A-002
- 型号: Hawkeye-WST6055
- 应用: <strong>Application:</strong> Applied to shipment after wafer cutting/postseal cutting, it inspects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency.
• Compatible Frame Wafer<br> • IR Hidden Crack Support<br> • INK inkjet Support
Capability
Project
Content
Product Type
6 ", 8 ", 12 " frame wafer
2D Inspection ltems
Foreign objects, residual glue, particles, scratches, hidden cracks, contamination, CP
deviation, excessive area, etc
Cutting channel deviation and chipping
Cutting Path
Inspection Items
6 ", 8 ", 12 " frame cassetee
Lens and
Resolution
2x( 2.75um)/3. 5x( 1. 57um)/
5x( 1. 1um)/7. 5x( 0.73um)/ 10x( 0. 55um)
Precision
0. 55μm/pixel
Optional and Customized
INK module, IR module
Inspectable Area
Front side inspection(standard configuration), back side inspection(customizable) Imaging
Scratch
Dirt
IR with Crack
IR without Crack
Probe (Pad corrosion)
Probe (skewing)
Cutting edge chipping
Ink dot inspection
Keywords :
AOI Equipment
Automation
Software Systems
AOI Vision Upgrade
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