Classification:
Hawkeye-TCP6010TR/TCP6010TT
Tray to Tray&Reel Chip Inspection Equipment
Application: Applied after final test, it can detect appearance defects in encapsulated devices by JZ 's patented 2D/3D vision inspection system.
• Six-sided Appearance Inspection
• Optional 2D/3D Function Configuration
• Automatic Tape Collection
Capability
|
Project |
Content |
|
Product Type |
LGA、QFN、 BGA、QFP、SOP |
|
2D Inspection |
Cracks, adhesive residue, damage, abnormal solder balls, foreign objects, positional accuracy of solder balls |
|
3D Inspection |
BGA height, coplanarity, etc |
|
Tray and transmission method |
JEDEC standard tray |
|
Product Size |
3mmx3mm-50mmx50mm(customizable beyond this range) |
|
Support Incoming Materials |
Tray to Tray&Tray to Reel&Reel to Tray |
|
2D Visual System |
25MP |
|
Pixel Resolution |
10μm/pixel |
|
Optional and customized |
5S/3D/Reel modules |
Imaging
 Surface voids in encapsulation |
 Pin deformation |
 Foreign matter on the pad |
 Solder ball damage & missing |
 Side pin co-linearity |
 5S inspection |
 Cover film damage |
 Pin stand-off height |
- Product Description
-
- Commodity name: Tray to Tray&Reel Chip Inspection Equipment
- Commodity ID: A-005
- 型号: Hawkeye-TCP6010TR/TCP6010TT
- 应用: <strong>Application:</strong> Applied after final test, it can detect appearance defects in encapsulated devices by JZ 's patented 2D/3D vision inspection system.
• Six-sided Appearance Inspection<br> • Optional 2D/3D Function Configuration<br> • Automatic Tape Collection
Capability
Project
Content
Product Type
LGA、QFN、 BGA、QFP、SOP
2D Inspection
Cracks, adhesive residue, damage, abnormal solder balls, foreign objects, positional accuracy of solder balls
3D Inspection
BGA height, coplanarity, etc
Tray and transmission method
JEDEC standard tray
Product Size
3mmx3mm-50mmx50mm(customizable beyond this range) Support
Incoming Materials
Tray to Tray&Tray to Reel&Reel to Tray 2D Visual System
25MP
Pixel Resolution
10μm/pixel
Optional and customized
5S/3D/Reel modules
Imaging
Surface voids in encapsulation
Pin deformation
Foreign matter on the pad
Solder ball damage & missing
Side pin co-linearity
5S inspection
Cover film damage
Pin stand-off height
Keywords :
AOI Equipment
Automation
Software Systems
AOI Vision Upgrade
Leave us a message
Jiaxing Jiuzong Intelligent Technology Co., Ltd.
Jiaxing Headquarters
Address: Building 6, Visual Internet of Things Innovation Centre, Tongxiang Economic Development Zone
Ningbo Branch
Address: No.2588, Sanbei Street, Baisha Road Street, Cixi City, Zhejiang Province
Shenzhen Branch
Address: No.27-3, Xintang Road, Fuhai Street, Baoan District, Shenzhen City
Changsha Branch
Address: Wuju Lane, Langli Street, Changsha County, Changsha City
Wuhan Branch
Address: Building 5, Future Light, Optics Valley Avenue, East Lake New Technology Development Zone, Wuhan City
Scan code consultation more
© Jiaxing Jiuzong Intelligent Technology Co., Ltd.